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FACILITIES

Electrochemical testing equipment in our laboratory:

  • Two Glove Boxes (96" wide, 4 gloves/each, < 1 ppm. of oxygen and water, on-board water content analyzer, two ante chambers, vacuum oven up to 220 C)
  • Electrochemical Test Station (Solatron 1287 Electrochemical Interface coupled with Solatron 1255B Frequency Response Analyzer)
  • MultiChannel Potentiostat (8 channels, Solatron 1480 MultiStat)
  • Supercapacitor Testing System / MultiChannel Potentiostat (8 channels, Arbin SCTS)
  • Three MultiChannel Battery Testing Systems / MultiChannel Potentiostats (3 x 24 channels, Arbin SB2000)
  • Three Controlled Temperature Testing Chambers (from -77 to +200 C)

Synthesis equipment in our laboratory:

  • Three Low Pressure Chemical Vapor Deposition (LPCVD) systems (custom design)
  • Atomic Layer Deposition (ALD) system (custom design)
  • Silicon LPCVD system (custom design)
  • Hydrothermal Synthesis system (custom design)
  • Two Atmospheric Pressure Chemical Vapor Deposition (APCVD) systems (custom design)

Centralized facilities of Georgia Institute of Technology provide us with access to a variety of major analytical and manufacturing tools supported 24/7 by trained technicians and research staff.

Georgia Tech Microelectronics Research Center directed by Dr. James Meindl offers access to the following equipment:
    

  • Chemical Vapor Deposition (Tystar TYTAN Furnace systems for all conventional atmospheric and low pressure CVD; Lindberg sintering furnace; Unaxis Plasma Enhanced CVD (PECVD), Coyote PECVD, STS PECVD, PlasmaTherm PECVD) to grow poly-silicon, oxide and nitride films, silicon carbide, diamond-like carbon, and other materials employed in the semiconductor industry
  • Physical Vapor Deposition ( CVC RF Sputterer, PVD75 RF Sputterer, Unifilm Sputterer, PVD75 Filament Evaporator, and two CVC E-beam Evaporators, among others) to deposit metal films and dielectrics
  • Nano Lithography (JEOL JBX-9300FS EBL System with 4 nm spot electron beam, 50/100kV accelerating voltage, 50 MHz scan speed)
  • Optical Lithography (EV620 Mask Aligner, Karl Suss MA-6 Mask Aligner TSA/BSA, Karl Suss MA-6 Mask Aligner DeepUV, Karl Suss MJB-3 Mask Aligner, OAI ask Aligner, six 100CB Spin coaters, and Karl Suss RC8 Spin Coater, among others)
  • Etch Processing (Plasma-Therm Inductively Couples Plasma (ICP) Etcher, STS ICP, Trion ICP, Samco UV Ozon Dry Stripper, Plasma-Therm SLR Reactive Ion Etcher (RIE), Vision RIE, and STS Advanced Oxide Etch System among others)
  • Analytical tools (Woollam Ellipsometer, Plas-os Ellipsoeter, Tencor Alpha Step Profilometer, Tencor KLA Profilemeter, Wyko Profilometer, Nanospec Refractometer, Veeco Dimension 3100 Scanning Probe Microscope (SPM), SemiTest SCA-2500 Surface Charge Analyzer, Hysitron TriboIndenter, Veexo Four-Point Probe Station, and X-Ray Photoelectron Spectroscopy System, among others)

Georgia Tech Center for Nanostructure Characterization and Fabrication directed by Prof. Zhong Lin ‘ZL’ Wang offers access to the following equipment:

  • Focused Ion Beam (FEI Quanta, FEI Nova)
  • Transmission Electron Microscopy (JEOL 4000EX, JEOL 100 CX)
  • Scanning Electron Microscopy (LEO 1530 TFE, LEO 1550 TFE, Hitachi S800 FE)
  • Nanoindenter (XP by MTS)
  • Atomic Force Microscopy (Digital Instruments AFM)
  • X-Ray Diffraction (PANalytical X’Pert PRO Alpha-1, PANalytical X’Pert PRO MPD, PANalytical X’Pert PRO MPD, ICDD PDF-2 database 2002, Hi-Score search-match software)

Facilities at Nanotech Research Laboratory directed by Prof. Yushin